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This interview was held with Bram De Muer, CEO of ICsense
Tell me a bit about your background? How did you first get started with ICsense?
I am a microelectronics engineer by education. Engineering has always been in my blood, whether it was constructing novel
We wrote before about multi project wafer benefits for IC designers of using MPW multi-project-wafer services.
Multi Project Wafer service is allowing companies to share the expensive mask cost. Essentially, Multi project wafer (MPW) services integrate onto silicon wafers several different integrated circuit designs from various teams. These designs
Shanghai, China, March 28, 2024 — VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True
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Like architects shaping skylines, VLSI engineers are the masterminds behind the intricate circuits that power modern electronics. In the world of microelectronics, they play a pivotal role, crafting the very foundation upon which today’s technology thrives.
Core Responsibilities in Chip Creation: VLSI engineers are tasked with developing and refining
Like a master tailor crafting a bespoke suit, an ASIC engineer designs circuits tailored for specific applications with precision and expertise.
Analogous to architects who shape skylines, ASIC design engineers sculpt the electronic landscape by creating custom integrated circuits – the foundation upon which today’s technology stands.
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An Application Specific Integrated Circuit (ASIC) is a specialized integrated circuit crafted for a particular use or purpose. Typically, ASICs are tailored for products targeted for mass production, consolidating necessary electronics onto a single chip.
ASIC stands for “Application Specific Integrated Circuit.”
Despite the substantial initial
In order to cater to the computing demands for high performance computing (HPC) and artificial intelligence (AI), a need for a scalable package was felt. Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and
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Meyreuil, France—March 19, 2024—Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, will exhibit its turnkey ASIC design and production services at Embedded World, taking place April 9-11, 2024, in Nuremberg, Germany. Presto CEO, Cedric Mayor, will present “Going ASIC – Myth or
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Mar. 12, 2024 —- The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world’s top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple’s latest
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Leuven, March 1st 2024 – “In February 2004, we started ICsense with a team of 4 people and today ICsense employs over 100 dedicated chip experts”, says CEO Bram De Muer. “We’re really proud to have the best fab-independent European IC design team with world-class expertise in analog, digital, mixed-signal and high-voltage design.
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