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This interview was held with Ravishankar Balasubramanian, CEO of BLR LABS Pvt Ltd.
Q : Tell me a bit about your background? How did you first get started with BLR LABS?
Thank you for asking me that question. Personally speaking, I come from a challenging background
AN JOSE, Calif., Feb. 28, 2024 — QuickLogic Corporation (NASDAQ: QUIK), a leading developer of embedded FPGA (eFPGA) IP and User Tools, ruggedized FPGAs, and Endpoint AI/ML solutions, is proud to announce its selection by a top-tier Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries’ 12LP, 12nm low-power process.
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In their latest report TrendForce revealed that in 2023, Semiconductor foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share. This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%. Not only is TSMC leading in revenue, but it has also
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February 26, 2024 — Noesis Technologies has announced today the immediate availability of its ntFFT_UHS IP Core that implements a customized FFT/IFFT programmable fixed point (Decimation in Frequency – DIF) transform processor, supporting low latency, streaming, ultra-parallel complex samples per clock cycle in natural order. Input, internal and output 2’s complement
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February 20, 2024: Avnet ASIC Israel Ltd, (AAI) a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica, an Avnet company (NASDAQ: AVT), has been appointed as a Value Chain Aggregator (VCA) by TSMC, the world’s leading silicon foundry. The appointment positions Avnet
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LONDON, Feb. 14, 2024 — Reduced Instruction Set Computing (RISC)-V processor architectures are starting to address edge Artificial Intelligence (AI) workloads, and this trend is set to continue throughout the decade. According to a new report from global technology intelligence firm ABI Research, while RISC-V’s penetration into AI workloads is only just beginning,
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eDRAM Overview
A key factor in improving memory operations in System on Chips (SoC) is the use of embedded dynamic random-access memory (eDRAM), which means that the DRAM memory is inside the chip. This helps with enhancing the effectiveness and functionality of electronic products by reducing power consumption and
Portland OR – February 6, 2024 — Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems. This initiative reflects Trilinear’s commitment
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iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to
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This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
Tell me a bit about your background? How did you first get started with Rochester Electronics?
Sure, let me share a bit about my journey. I kicked off my