Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Hsinchu, Taiwan, – Nov 20, 2019 — Attopsemi Technology attended SOI Symposium on October 30th, 2019 in Yokohama, Japan and provided a talk “I-fuse™: A Disruptive OTP Technology”. The event was a huge success and attracted several hundreds of attendees.
In a well-received speech during the EDA/IP Session, Shine Chung,
Meyreuil, France – November 20, 2019—Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces the hire of two new executives: Sophie Vaucher, vice president Finance, and Alexandra Moulin, vice president Human Resources.
“We are delighted to add Sophie and Alexandra to our
IC Insights’ November Update to the 2019 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2019 (the top-15 2019 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments, and
Read More
Faraday Technology Corporation(TWSE: 3035), a leading ASIC design service and IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt
Read More
Meyreuil, France – November 12, 2019—Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, has achieved EAL6 (Evaluation Assurance Level 6) — an assurance and independent verification of very high levels of security to protect valuable data.
“Presto Engineering is a secured application
SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement
Read More
SmartDV™ Technologies will exhibit at SemIsrael Expo 2019 in Airport City, Israel, November 19 and ICCAD China 2019 November 21-22 in Nanjing, China.
At both events, SmartDV will showcase why it is the Proven and Trusted choice for Verification and Design Intellectual Property (IP), including new additions to its
Santa Clara, California (November 5, 2019) – Marvell (NASDAQ: MRVL) today announced that it has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GLOBALFOUNDRIES. After working capital adjustments, the net deal consideration of approximately $600 million is being funded by a short-term bridge loan. By
Read More
IC Insights’ November Update to The McClean Report 2019 will include a capital spending forecast for the major semiconductor companies for 2019 and 2020. In January of next year, IC Insights will release The McClean Report 2020 and present its seminars that review the five-year forecasts for the IC industry.
The share of semiconductor industry capital
Hsinchu, Taiwan R.O.C. and Santa Clara, CA, Oct. 29, 2019 – TSMC and GLOBALFOUNDRIES (GF) today announced they are dismissing all litigation between them as well as those that involve any of their customers. The companies have agreed to a broad life-of-patents cross-license to each other’s worldwide existing semiconductor patents as
Read More