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SAN JOSE, Calif.– November 20, 2019 –Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced that Alereon, a leader in Ultra-Wideband solutions, has adopted Omni Design’s Analog-to-Digital (ADC) and Digital-to-Analog (DAC) Converters sampling at greater than 1GSPS for its next generation UWB chipset.
“We
The Mayflower Steps, where the Pilgrims are believed to have embarked on their journey to America, are located in the beautiful Barbican area of Plymouth, a small town in the southwest of England. As the lone American working for Moortec, a British company based in Plymouth, I stood and stared at
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Hsinchu, Taiwan, – Nov 20, 2019 — Attopsemi Technology attended SOI Symposium on October 30th, 2019 in Yokohama, Japan and provided a talk “I-fuse™: A Disruptive OTP Technology”. The event was a huge success and attracted several hundreds of attendees.
In a well-received speech during the EDA/IP Session, Shine Chung,
Meyreuil, France – November 20, 2019—Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces the hire of two new executives: Sophie Vaucher, vice president Finance, and Alexandra Moulin, vice president Human Resources.
“We are delighted to add Sophie and Alexandra to our
IC Insights’ November Update to the 2019 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2019 (the top-15 2019 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments, and
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Faraday Technology Corporation(TWSE: 3035), a leading ASIC design service and IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt
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Meyreuil, France – November 12, 2019—Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, has achieved EAL6 (Evaluation Assurance Level 6) — an assurance and independent verification of very high levels of security to protect valuable data.
“Presto Engineering is a secured application
SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement
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SmartDV™ Technologies will exhibit at SemIsrael Expo 2019 in Airport City, Israel, November 19 and ICCAD China 2019 November 21-22 in Nanjing, China.
At both events, SmartDV will showcase why it is the Proven and Trusted choice for Verification and Design Intellectual Property (IP), including new additions to its
Santa Clara, California (November 5, 2019) – Marvell (NASDAQ: MRVL) today announced that it has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GLOBALFOUNDRIES. After working capital adjustments, the net deal consideration of approximately $600 million is being funded by a short-term bridge loan. By
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