Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
On-chip capacitors are a critical element in analog and mixed signal ASIC designs and playing a key role in helping engineers reach target performance. On-chip capacitors are limited in their quality and size and often introducing design challenges where engineers need to compromise capacitor type, chip cost and performance. This
Read MoreSiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $65.4 million in a Series D round led by existing investors Sutter Hill Ventures, Chengwei Capital, Spark Capital, Osage University Partners and Huami, alongside new investor Qualcomm Ventures LLC. This Series D round
Read MoreIC Insights will release its June Update to the 2019 McClean Report later this month. This Update includes a 2017-2023 IC database that segments the actual 2017 and 2018 and forecasted 2019-2023 IC market by major product type by Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, and Asia-Pacific
Read MoreInfineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Cypress Semiconductor Corporation (NASDAQ: CY) today announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9.0 billion.
Reinhard Ploss, CEO of Infineon,
BrainChip Holdings Ltd (ASX: BRN), the leading AI EDGE company, today announced the availability of the Company’s Akida Neural Processing Core (“NPC”) as intellectual property available for licensing. This introduction marks a major development in the Company’s market presence.
The Akida NPC is now available to license as an
Read MoreSan Jose, California – May 29, 2019. Mixel® Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI® IP has been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.
The
Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that its technology to protect wireless antenna pads is now published as a patent by the European Patent Office. The clipping/scaling circuit is used to protect the Near Field Communication (NFC) antenna pads in an ultra-low power Bluetooth chip
Read MoreChina’s biggest semiconductor foundry is to withdraw from the New York Stock Exchange. SMIC notified the NYSE of its intention to apply on June 3 to delist its American depositary receipts (ADRs) from the bourse.
SMIC cited “a number of considerations,” including the limited trading volume of its ADSs
Semiconductor intellectual property (IP) provider CAST, Inc. today announced two extensions to its line of UDP/IP cores for lean Internet Protocol networking: an increase up to 32 channels for its existing 10G and 40G UDP/IP Hardware Protocol Stacks, and the upcoming release of a faster, 100G version of these IP cores.
The
IC Insights will release its May Update to the 2019 McClean Report later this month. This Updateincludes a discussion of the 1Q19 IC industry market results, a detailed quarterly IC market forecast for the remainder of this year, and a look at the top-25 1Q19 semiconductor suppliers.
Over its 60-year history, the IC industry is