Die Bond

Die bond is a relatively simple and low cost process of connecting die pads to a substrate, a leadframe or a PCB as part of the assembly process. Today, die bond is used in most of semiconductor products.

Recent Stories

Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

Faraday Reports Full Year 2024 Results

Faraday Reports Full Year 2024 Results

SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia

SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia

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YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI

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Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP

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Top Semiconductor Foundries 2024 Revenue

Top Semiconductor Foundries 2024 Revenue

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