An interposer can be defined as a silicon chip that can be used as a bridge or a conduit that allows electrical signals to pass through it and onto another element. Interposers are normally very frequently used in multi die chips or boards. The job of an interposer is to either spread the signal to a wider pitch or take the connection to a different socket on the board.



The major benefit of sign interposer as opposed to stacked die and wires is that it offers a larger conduit or bridge of the signal to flow through, ensuring that the distance between the IP blocks in the system has been shortened and that the resistance/capacitance delay has been reduced down to a minimum. Interposers can be made from silicon or organic material, but their purpose remains the same. The latter have, however, been found to be more resilient.


Silicon bridging is quickly becoming one of the most popular and frequently opted for choices when it comes to packaging. These are essentially links that are attached to the substrate by Through Silicon Vias or TSVs. The interposer can then be metallized from the top, bottom, and side to connect it to the surrounding components of the system. This makes interposers a versatile and adaptable packaging system.


Silicon Interposer Advantages


To begin with, interposers offer you to significantly reduce the size of your system as opposed to Printed Circuit Boards or PCBs. as opposed to the 75/75 micron linewidth and space, interposers lie at a mere 5/5 micron. It also accounts for an improvement in the performance of the device as the interconnect are formed using semiconductor technology. With the reduction in size and the improvement in efficiency, your system starts to waste a lot less power. It is also extremely easy to pre process TSV substrates and store them for later use whenever there is a need for rapid prototyping at a short time’s notice. As such, silicon interposers make for the perfect companion when it comes to heterogeneous systems and technologies.

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