Taiwan Semiconductor Manufacturing Company (TSMC) will break ground next month on its most advanced fabrication plant to date, focused on the 1.4-nanometer process node, internally known as A14.
The new project, located in the Taichung sector of the Central Taiwan Science Park, will form part of Fab 25. This expansion includes four dedicated fabs and represents a significant increase in TSMC’s production capacity. Preparatory work such as land transfer, water detention systems, and environmental measures is scheduled to be completed by the end of September 2025. Construction will then begin in October.
The company expects the first fab, referred to as P1, to begin risk-stage production in late 2027, with mass production starting in the second half of 2028. Output is projected at around 50,000 wafers per month once the ramp is complete. The development will generate substantial economic activity, including billions of New Taiwan dollars in opportunities for construction, equipment, and service providers, as well as large-scale use of low-carbon building materials.
Technologically, the A14 node marks an important step forward. It introduces second-generation gate-all-around (nanosheet) transistors and a refreshed standard cell architecture. Compared with the previous N2 generation, A14 is expected to deliver up to 15 percent higher performance at the same power or 25 to 30 percent lower power at the same speed. It also achieves around a 20 percent increase in transistor density, representing a full-node advancement without requiring high numerical aperture EUV lithography. TSMC has confirmed it will continue to rely on current EUV tools rather than adopting high-NA EUV at this stage.
The decision to build four new fabs in Taichung highlights Taiwan’s continuing central role in TSMC’s most advanced manufacturing, even as the company expands internationally. The A14 process is expected to support the next wave of high-performance, energy-efficient chips by 2028, with major technology companies likely to be among the first adopters.
TSMC’s entry into the 1.4-nanometer era is a milestone in semiconductor scaling, combining technological innovation, economic impact, and strategic positioning to maintain its leadership in the global chip industry.
