IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month. A portion of the Mid-Year Update will examine semiconductor industry capital spending trends with an industry-wide forecast through 2023. In addition, the Update will include IC Insights’ capital spending forecast for each of the 32 major spenders for 2019 and
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Moortec Semiconductor Ltd, providers of complete In-Chip PVT (Process, Voltage and Temperature) Monitoring Subsystems announced today that Achronix Semiconductor Corporation have chosen Moortec’s 7nm Embedded Temperature Sensor IP to optimise performance and increase reliability for the company’s Speedster®7t FPGAs
Achronix specialise in high-performance FPGA solutions that include high-density FPGA
IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month. A portion of the Mid-Year Update will examine the trends for worldwide IC company marketshare by headquarters location.
Figure 1 shows the 2018 IDM and fabless company shares of IC sales as well as the total worldwide share of
Semiconductor startups SiFive and Morse Micro are joining forces to host a one-day tech symposium focusing on the RISC-V processor architecture. The event will take place in Sydney on Friday, June 21 at The Warren Centre for Advance Engineering at the University of Sydney, and will feature presentations by industry
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Neuchatel, 19 June 2019—Combining CSEM’s ultra-low-power ASIC design experience with the Extreme-Low Power (ELP) DDC technology from MIFS enables new world records in power consumption. A complete process design kit, along with a range of mixed-signal silicon IPs, is now available.
The phenomenal growth of the Internet of Things
In the wake of tariffs and trade tension between China and the United States, government officials and company representatives throughout China have doubled down on their resolve to quickly and meaningfully grow the nation’s domestic IC business in order to reduce its dependence on critical IC components currently supplied by
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