The term tapeout is seemingly a strange name for the final product considering that no form of tape is used in the process. However, the origins of the name go back to a time before computers or digital storage was invented. It is important to understand that a tapeout or
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Researchers estimate that there are about 80,000 earthquakes globally each year, but most are too minor to notice. The Great East Japan Earthquake (a.k.a., 2011 Tohoku Earthquake) and subsequent tsunami that struck east of Sendai on March 11, 2011 caused substantial loss of life and destruction to infrastructure. It was
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An interesting report from Y Combinator shows increase in number of hardware companies applying to their accelerator program.
Software is eating the world but often that software is going to come packaged in beautiful, piece of hardware. While VC’s believe it takes $80M to get a semiconductor company off the ground
Mie Fujitsu Semiconductor Ltd (MIFS) and CSEM have penned a joint development agreement to cooperate in the development of Deeply Depleted Channel (“DDC”) and near/sub-threshold technologies for the IOT/Wearables market. The agreement encompasses the development of ultra-low voltage, ultra-low power standard cell libraries, power management cells and memories as well
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Chandler, Arizona and San Jose, California – May 7, 2015 – Microchip Technology Incorporated (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated (NASDAQ: MCRL) today announced that Microchip has signed a definitive agreement to acquire Micrel for $14.00 per share. Micrel shareholders may
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Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components into the package substrate and stacking of ICs and packages using wirebond and package on package (POP) technologies. This has led to the development of technologies that can
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