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Top Semiconductor Foundries Capacity 2015-2016 (Infographic)

On a yearly basis, AnySilicon provides a snapshot of top semiconductor foundries wafer capacity, based on available data on their website. In our last yearly report , we have presented semiconductor foundries capacity ranking of the top 4 pure-play wafer fabs: TSMC, GLOBALFOUNDRIES, UMC and SMIC. This year, our report has

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The 2 Easiest Ways to Find IP Cores

IP cores availability and quality have become a critical factor to any SoC design success. Engineers have to find and qualify different IP cores quickly and effectively to help boost time to market and reduce the need of unnecessary re-spins.  Moreover, with today’s aggressive time to market demands and the

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Amazon is starting to sell SoCs

The semiconductor industry was a bit puzzled last year when Amazon acquired Annapurna Labs (Israel) for $350 million; the analysts believed that Amazon is planning to use Annapurna’s chips in its own data centers. But now it turns out that Amazon is taking advantage of the deal to enter the

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Advanced Packaging Supply Chain – what is new?

The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape”, comments Andrej Ivankovic, Technology &

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Foundry Ranking Capacity 2015

IC Insights has released its Global Wafer Capacity 2016-2020 report that provides in-depth detail and analysis of foundry ranking capacity by wafer size, by process geometry, by region, and by product type. The new report provides a ranking of the industry’s 25 largest IC manufacturers and foundries in terms of installed

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Mobility Drives Thin Packaging

For the packaging industry, the smartphone changed everything, and experts agree that more changes— potentially big ones—are underway.
 
Bill Chen, a senior fellow at ASE Group, said when personal computers ruled chip demand, the main components had fairly standard package formats. The pace of change has picked up in

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