WASHINGTON—Feb. 7, 2025—The Semiconductor Industry Association (SIA) today announced global semiconductor sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. Additionally, fourth-quarter sales of $170.9 billion were 17.1% more than the fourth quarter of 2023, and 3.0% higher than the third
Read MoreFebruary-7, 2025 — TSMC , Taiwan’s leading semiconductor manufacturer, is reportedly planning a new 1-nanometer fabrication plant in Tainan’s Shalun area. This massive facility, a Giga-Fab capable of housing six 12-inch wafer fabs, aims to leverage the existing advanced manufacturing cluster in the Southern Taiwan Science Park (STSP). Its location
Read MoreFebruary 6, 2025 — GlobalFoundries (GF), a leading semiconductor manufacturer, announced a significant leadership transition and outlined ambitious expansion plans this week. Effective April 28th, 2025, Tim Breen, currently the Chief Operating Officer (COO), will succeed Thomas Caulfield as President and CEO. Caulfield, who has served as CEO since 2018,
Read MoreThe semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications. Several key players are significantly expanding their capacity, aiming for substantial production increases by 2025. This expansion is geographically diverse, with major projects underway in
Read MoreNORTH READING, Mass.–(February 3, 2025 )– Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test solutions, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
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Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process
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