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Process Design Kit: Ultimate Guide

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A Process Design Kit simplifies the complexities of chip design by providing essential resources for IC engineers, including design rules, models, and documentation. This toolkit not only streamlines the development process but also ensures that designs can be manufactured successfully with high yield rates. The semiconductor industry relies heavily on

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Building a Fabless Semiconductor Business: A Practical Guide

Examining a microchip

In the fast-evolving landscape of semiconductor technology, the term “fabless semiconductor companies” stands as a testament to innovation and adaptability. These companies epitomize a strategic approach, focusing on design, innovation, and market agility while outsourcing the manufacturing aspect of semiconductor production. In this dynamic realm, giants like Qualcomm and Nvidia

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Chiplet Summit 2025

chiplet

January 21, 2025 – January 23, 2025
Why should we go this summit

Why to Attend:

Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts

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UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance

press release

Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated (NASDAQ:QCOM) for high-performance computing (HPC) applications. This win marks a pivotal moment, challenging the long-held dominance of Taiwan Semiconductor Manufacturing Company (TSMC) in this critical sector.
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Cadence Appoints Moshe Gavrielov to Board of Directors

cadence moshe

12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov currently serves as a member of the board of NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company Ltd., as chair

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Apple’s First AI Server Chip to be Engineered in Israel

Apple Silicon Journey

Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence (AI) market with the development of its first custom server chip, codenamed “Baltra,” designed specifically for AI processing. This groundbreaking initiative, reported by The Information and further detailed in recent reports, marks a significant step in Apple’s efforts

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