Jun. 12, 2024 —- As indicated by the survey of global market intelligence firm TrendForce, 1Q24 marked the entry of a traditional off-season for the consumer end, where the sporadic appearance of urgent orders within the supply chain were mostly replenishment of inventory among individual clients, and exhibited sluggishness in momentum
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Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.
This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower
In this guide, we’ll elucidate the pivotal role of FO-PLP in advancing the semiconductor sector. Harnessing cost-effectiveness with enhanced functionality, FO-PLP beckons a new era of electronic sophistication. Let’s delve into the ultimate guide to Fan-Out Panel-Level Packaging and explore how it’s shaping the future.
Overview of Fan-Out Panel-Level
By Christos Kasparis, EnSilica
EETimes (May 15, 2024)
The rise of quanum computing paints a significant challenge for the cryptography we rely on today. The modern encryption standards we currently use to safeguard sensitive data and communications, such as DSA, public key RSA and those based on elliptic curves,
In this guide, we’ll delve into what exactly embedded die packaging is, exploring its definition, and the myriad of benefits it provides across various applications. From space-saving designs to improved heat dissipation, this innovative approach to integrating semiconductor dies is pivotal for modern electronics.
Image courtesy: ASE
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AnySilicon, the leading platform for ASIC service providers, is delighted to announce its partnership with Avnet ASIC Israel, a distinguished leader in semiconductor design, manufacturing solutions and TSMC VCA. By joining AnySilicon, Avnet ASIC Israel gains access to a comprehensive suite of marketing promotion services aimed at showcasing its offerings,
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