Silex Insight, a leading provider of cryptographic IP solutions, is now extending their offering by launching a high throughput DDR encrypter (100Gbps). The DDR encrypter IP Core module enables on-the-fly encryption and authentication to the external memory. It is highly configurable and may be optimized for various size, throughput, and
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IC Insights’ forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report. The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog
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Figure 1 shows that after surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of $190.4 billion, up 86% from just three years earlier in 2019. Moreover, if capital spending increases by ≥10% in 2022, it would mark the
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Wafer cost is a critical component of IC cost calculation. Wafer cost is based on 4 main factors: wafer technology node, e.g. 5nm, 65nm, 130nm, etc. Wafer options/features, e.g. all the options required on top of the plain vanilla, e.g. mim cap, flash, high voltage, etc. Wafer volume, e.g. how
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There are numerous steps that are involved in the design of digital (or mixed signal) circuits starting from system specifications right till the chip is manufactured. One of these steps is a process of transforming a functionally described circuit (normally in netlist) into physical layout at the lowest level (normally
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First introduced by Bell Labs in 1957, wire bonding is an integrated circuit (IC) manufacturing method used in more than 40 billion microelectronic devices each year. Wire bonding is used extensively for interconnecting semiconductor chips to package leads and many other applications that allow RF devices to meet stringent size,
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