This is a guest post by Stephen Crosher, CEO of Moortec
The rate of product development is facing very real challenges as the pace of silicon technology evolution begins to slow. Today, we are squeezing the most out of transistor physics, which is essentially derived from 60-year-old CMOS technology.
London, United Kingdom & Santa Clara, Calif. – February 20, 2020 – Dialog Semiconductor plc (XETRA:DLG), a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth® low energy technology, and Adesto Technologies Corporation (“Adesto”) (NASDAQ:IOTS), a leading provider of innovative custom integrated circuits (ICs) and embedded systems
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“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “SiP involves low-end including smaller package size & lower I/O count and high-end applications with larger package size & higher I/O. SiP is also leveraging
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The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing
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This interview was held with Martin Sallenhag, CEO, RoodMicrotec N.V.
Tell me a bit about your background? How did you first get started with RoodMicrotec?
After my master’s degree in electrical engineering at Lund University, I joined the mobile phone division of Ericsson where I designed
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its AIoT platform ASIC solution has successfully delivered more than 10 projects in AIoT applications. These demonstrated solutions span UMC process technologies from 55nm to 28nm, including edge applications in audio and vision recognition, smart
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