This article provides an overview and description of a typical IC layout process. Its describes the various steps within IC layout and the relationship between each step.
IC layout refers to the backend design cycle. If there’s just one aspect that distinguishes the backend design from frontend design, then
OPENEDGES Technology, Inc., the world’s leading supplier of Memory Subsystem IP including Network On-Chip (NoC) and DDR Controller today announced that ASICLAND has licensed OICTM NoC Interconnect IP and OMCTM DDR Controller IP for artificial intelligence, data center, automotive & other applications.
ASICLAND is a leading design services company who provides
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at ChipEx on May 13th in Tel Aviv, Israel. Sankalp Semiconductor’s booth will be displaying the company’s capabilities in digital, analog and mixed signal, custom layout, standard cell development, IO solutions,
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Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge
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IC Insights will report on and examine the 1Q19 worldwide IC market results in its May Update to the 500-page, 2019 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry next month.
From 1Q84 through 1Q19 there have been 141 quarters, and only seven of them registered an
The low latency leader for semiconductor IP, announced today that Innovium, a leading provider of networking solutions for data centers, selected Tamba Networks’ IP for its TERALYNX 12.8 Terabits/sec Ethernet switch, which is in production and has been selected by multiple leading OEMs, ODMs and hyperscalers.
“Innovium’s TERALYNX data-center