ASICs stands for Application Specific Integrated Circuits, and refer to semiconductor solutions design for a particular application, as opposed to other solutions like Field Programmable Gate Arrays (FPGAs) which can be programmed multiple times to perform a different functions. ASIC is also sometimes referred to as SoC (System on Chip).
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A new gold standard for electrical measurement in the emerging in vitro world of three dimensional models. That’s what Swiss medtech 3Brain has established by partnering with CSEM. Its Khíron chip enables fast, accurate intra-tissue measurement and continuous nutrient and oxygen supply through all tissue layers for the first time.
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“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of
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Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, on 17th Oct inaugurated its design centre in Hubli. Shri Shivendra Gupta, Joint Commissioner of Income Tax, Shri Manish Kasodekar, Assistant Commissioner, Income Tax, and Shri Vivek G Pawar, CEO of Deshpande Foundation inaugurated
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With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry sales to the computer market in 2018, based on IC Insights’ extensive part-two analysis of the integrated circuit foundry business
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Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), was awarded the 2018 TSMC Open Innovation Platform® (OIP) Partner of the Year Award for Analog / Mixed Signal IP for the second consecutive year at the recent TSMC OIP Symposium.
Silicon Creations has collaborated with