Author Archives: anysilicon

Name: anysilicon

T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018

T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
 
Mobile World Congress Shanghai is the

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Black Pepper Spices up the Arm Approved Design Partner Program

ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to

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Semiconductor Market Size – History and Forecast

Silicone wafers

The semiconductor industry is in constant growth and has a very promising future.  Industry’s market experts have agreed the market size will grow even more in next decade. Some believe the IoT and Automotive market segments are the key growth and will eventually change our lives forever. After all, semiconductors

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Elsys exhibits at Design Automation Conference 2018

Elsys with its comprehensive digital and mixed-signal SoC services and solutions stands for a reliable and agile design services company. Recognized on the market for its expertise and stability, Elsys has become a proud partner of Arm and IAR Systems.
 
Known for its best-in-class engineering support in domains of digital, analog and mixed-signal design,

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Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their AI FPGA-to-ASIC solution and the Uranus+™ ultra-low-power IoT SoC development platform at Design Automation Conference (DAC), June 25-27, 2018 in San Francisco, CA, USA.
 
Faraday’s FPGA-to-ASIC conversion service has successfully completed several AI related

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Understanding Wafer Bumping Packaging Technology

wafer bumping feature

Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the

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