Author Archives: anysilicon

Name: anysilicon

Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power saving, enhanced performance and lower system cost to meet

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Mnano selects Dolphin Integration’s six-channel Audio converter for its next generation of Smart Speakers

According to PR Newswire, being fueled by the rising demand for voice enabled devices, the global smart speaker market is likely to grow at a CAGR of 43.68% in terms of unit shipment during 2016–2022.
 
Early innovators as well as market leaders of these newly marketed products are demanding

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CEO Talk: Eli Geva

This CEO talk was held with Eli Geva,  CEO of Advanced Semiconductor Technology Ltd. (AST)
 

 
Tell me a bit about your background? How did you first get started with AST?
 
I’ve started to work at AST as a young ASIC engineer back in 1991 and my first project was

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Should You Use an ASIC In Your Product? – One Page Executive Summary

Two funny scientists

Application Specific Integrated Circuit (ASIC) is a type of a chip with a specific usage which can have a combination of analogue & digital functions, CPU, controllers, and diverse types of memory. The following are the benefits of using an Application Specific Integrated Circuit (ASIC) in your project:
 

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Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform

Partnership

Malaysian-based wafer foundry SilTerra Malaysia Sdn Bhd (Silterra) and Brazilian based Chipus Microeletrônica S.A. (Chipus) have jointly announced a partnership to provide analog IP solutions focusing on the Internet-of-Things (IoT) market for their mutual customers. This announcement marks a significant milestone of the multi-year collaboration between SilTerra and Chipus.
 
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Presto Engineering Provides High-Volume Wafer-Level Test for Maja Systems Wireless Data-Center Connectivity Solutions

News

Presto Engineering Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, and Maja Systems, a world-leading designer of millimeter wave (mmWave) connectivity and sensing solutions, jointly announce their successful collaboration in comprehensive wafer-level ATE for the Maja AirData™ family of terabit connectivity and data transport solutions.
 
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