Author Archives: anysilicon

Name: anysilicon

CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program

news

Santa Clara, California, RISC-V Summit — October 22, 2025 — Semiconductor intellectual property provider CAST today announced the CAST Catalyst™ Program, a new way for embedded system developers to adopt RISC-V processors faster and with less risk. Catalyst combines CAST’s proven 32-bit RISC-V processor IP cores with simplified configurations, flexible

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TSMC to Break Ground on 1.4nm “A14” Fab on November 5

TSMC building

October 21, 2025 — Hsinchu, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced plans to break ground on its new 1.4 nanometer (A14) fabrication facility in Taichung, Taiwan, on November 5, 2025. The groundbreaking marks a major milestone in TSMC’s ongoing roadmap toward next-generation

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TSN Technology from CAST Powers Advanced Cancer Treatment

press release

Woodcliff Lake, New Jersey — October 17, 2025 — Semiconductor intellectual property core provider CAST  today announced that its Time-Sensitive Networking (TSN) IP technology has been selected by the Eckelmann Group for integration into advanced heavy ion beam therapy systems developed for the Heidelberg Ion Beam Therapy Center (HIT), a

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Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range

press release

Oct. 06, 2025 –  Kaiserslautern, Germany — Creonic GmbH, a leading provider of ready-for-use IP cores for communication systems, announces the update of its Doppler Channel emulation IP core. The update introduces significant enhancements that increase flexibility and precision in satellite communication simulations.
 
The model now supports a wide range of satellite frequency

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Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

TEMPE, Ariz.–(BUSINESS WIRE)–Oct. 6, 2025– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
 
The expanded investment includes additional cleanroom space

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AMD signs AI chip-supply deal with OpenAI, gives it option to take a 10% stake

CPU chip installed on a computer motherboard

SANTA CLARA, Calif. — October 6, 2025 — Advanced Micro Devices (NASDAQ: AMD) today announced a landmark multi-year agreement with OpenAI, under which AMD will supply advanced Instinct™ MI450 AI accelerators to power OpenAI’s next-generation artificial intelligence infrastructure.
 
The partnership marks a significant milestone in AMD’s growth within the

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