Semiconductor manufacturing process starts with wafers having several dice. These dice are then probed by testers to verify quality of wafer that will be later on assembled and packaged into an integrated circuit commonly abbreviated as IC. These ICs are then placed inside large electrical systems and devices to be
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Intel’s CEO Brian Krzanich, announced today during his meeting with the US president, Donald Trump, to invest seven billion dollars in the next 3-4 years setting up a chip manufacturing plant in the city of Chandler, Arizona .
Intel, the world’s largest maker of processors for personal computers (PC), will
PLLs (phase-locked loops) are common analog circuits in SOCs (systems on chips). Almost all SOCs with a clock rate greater than 30 MHz use a PLL for frequency synthesis. However, a “one-size-fits-all” PLL does not exist. The devices have a range of frequency, power, area, performance, and functions. PLLs implemented
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Connected battery-based devices require always more computing power to run feature rich application programs while using the minimal energy to ensure the longest usage without recharge. As a result, fabless companies need to hunt down every “mA” to satisfy the low-power expectations of their SoC users.
Numerous System-on-Chips rely
TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction
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Aquantia Corp., a pioneer and market leader in high-speed Ethernet connectivity solutions for data centers, enterprise infrastructure and client connectivity, today announced the AQcite product line of FPGA-programmable Multi-Gigabit Ethernet Physical Layer (PHY) devices, integrating Aquantia’s AQrate BASE-T PHY with a Xilinx® Kintex®-7 FPGA. The new AQcite product line targets
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