GLOBALFOUNDRIES today announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the company plans to expand its global manufacturing footprint by establishing a 300mm fab in China. GLOBALFOUNDRIES is also investing in expanding
Read MoreAn integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact
Read MoreFor the first time since 1993, the semiconductor industry is expected to witness a new number 1 supplier. Samsung first charged into the top spot in 2Q17 and displaced Intel, which had held the number 1 ranking since 1993. In 1Q16, Intel’s sales were 40% greater than Samsung’s, but in
Read MoreARM has acquired Apical, a global leader in imaging and embedded computer vision technology that will allow next generation devices to understand and act intelligently on information from their environment. Apical is one of the UK’s fastest-growing technology companies* and its advanced imaging products are used in more than 1.5
Read MoreSemiconductor chipmaker Broadcom has acquired MagnaCom, which develops 5G wireless communications technology.
A MagnaCom patent and trademark, WAM technology can enhance virtually all wired and wireless applications, and most importantly – is backward compatible to all legacy QAM systems, while not requiring any changes to the antennae, radio or
The term tapeout is seemingly a strange name for the final product considering that no form of tape is used in the process. However, the origins of the name go back to a time before computers or digital storage was invented. It is important to understand that a tapeout or
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