Interesting and surprising cooperation: Intel is developing the modem chip to be used in the next iPhone’s devices. To meet Apple’s tough and tight schedule IBM has allocated a staff of about 1,000 people. Intel’s foothold in what is expected to be the world’s best-selling smartphone has a dramatic importance
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According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
The decision followed the new internal financial policy at Temsasek which aims to diversify the
PMC-Sierra, a provider of data center chips, will soon be part of the radio components manufacturer Skyworks after signing a $2billion purchase agreement.
Notwithstanding the fact that this deal might sound strange to many, the decision occurred as a simple product expansion and a chance to widen the buying
Introduction
Low power test efforts in SOC design are broadly classified into – fine tuning ATPG patterns, enhancing collaterals for supporting low power ATPG, architecture for low power DFT, improving estimation and correlation. The flow discussed here comes under the category of “fine tuning ATPG patterns”.
Currently due
GlobalFoundries is downsizing at its semiconductor plant in Germany by 20 percent, according to several newspapers in Germany.
GlobalFoundries has factories in Germany, Singapore and the USA. The “Fab 1” in Dresden is one of the largest private employer in the city. The plant is equipped with a clean room
Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12”eq.wafers) in 2020, supported by the wider adoption of Cu pillar technology. That growth will be led by Moore’s law pushing beyond the 28nm node and ‘More than Moore’ evolution in next generation
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