In past few months, while interacting with customers, I came across a couple of cases where the VIP played a spoilsport. In one case, the IP & VIP were procured from the same vendor during the early phase of standard protocol evolution. One of the key USPs of the product was
Read More
“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for
Read More
While the entire semiconductor industry is excited about FinFET and FDSOI process technologies, there is one semiconductor technology that considered by engineers as “the process for real men” and it’s called BiCMOS.
BiCMOS process is essentially a combination of Bipolar transistor and CMOS transistors, it offers many technical advantages
Sony has announced that its semiconductor unit will now be separated from the company’s core business. The strategic decision arrived in order to allow the Japanese electronic firm to focus its resources and attentions on the Devices and the Digital image divisions. This last one in particular, in fact, has
Read More
Interesting and surprising cooperation: Intel is developing the modem chip to be used in the next iPhone’s devices. To meet Apple’s tough and tight schedule IBM has allocated a staff of about 1,000 people. Intel’s foothold in what is expected to be the world’s best-selling smartphone has a dramatic importance
Read More
According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
The decision followed the new internal financial policy at Temsasek which aims to diversify the