HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform
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Semiconductor Assembly and Test Services are converting rapidly into a pure outsourcing mode of operation. While today perhaps only 50% of the market is using Outsourced Semiconductor Assembly and Test (OSAT, or SATS) this number is set to increase in the future.
While many of the low-end suppliers are
QFN package is probably the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications.
QFN (quad-flat no-leads) is a plastic SMT package consisting of: a leadframe, single or multiple dies, wirebonds and a molding compound. The
There are many ways to deliver, package and transport silicon products. Here’s a short primer that provides the basic facts regarding how silicon can be packed and delivered to ensure safe transportation with minimum damages.
There are two main options for receiving wafers from your foundry: tested or untested.
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This post describes the growth of top 10 semiconductors companies in the last 10 years. It tracks the growth of the 10 semiconductor leaders from 2002 to 2011 and shares some nontraditional thoughts about the ten semiconductors vendors’ success:
Thought #1: Follow the market trends
Since the 80’s companies from USA,
Paul Otellini has made the best decision for himself and for Intel. He is leaving the company.
There are only a few who don’t admire Intel. Intel has introduced ground breaking technologies decade after decade and has been demonstrating top financial results year after year. Is it beneficial for Intel