TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
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[Santa Clara, USA], [October 3rd, 2024] – MosChip® Technologies, a semiconductor design and product engineering services company, is excited to announce the launch of MosChip DigitalSky™, a comprehensive suite of digital solutions aimed at transforming global enterprise into a connected and intelligent entity. It enables organizations to thrive in the
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Taipei, Taiwan – October 2, 2024 – Powerchip Semiconductor Manufacturing Corporation (PSMC), a leading Taiwanese foundry, has announced a strategic shift in its global expansion plans, opting to scrap a previously announced semiconductor fab project in Japan in favor of building a new fab in Gujarat, India. The decision comes
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Tokyo, Japan – October 2, 2024 – Toppan Photomask, a global leader in the semiconductor photomask industry, will officially change its name to Tekscend Photomask on November 1, 2024. The rebranding represents a strategic move to reflect the company’s ongoing commitment to technological innovation and growth as a premier photomask
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Beijing, China – October 2, 2024 – China’s integrated circuit (IC) exports have experienced a remarkable recovery in 2024, showing strong growth despite recent global downturns in the semiconductor industry. According to customs data reported by People’s Daily, IC exports from China in the first eight months of 2024 reached
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MILPITAS, Calif. — September 26, 2024 — Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report. The robust spending is being driven by the regionalization of semiconductor fabs and
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