September 5, 2024 – The leaders of India and Singapore have signed a significant agreement to enhance cooperation in the semiconductor sector. This partnership aims to strengthen Singaporean firms’ roles within India’s supply chains, marking a pivotal development in both countries’ economic collaboration.
The Memorandum of Understanding (MoU) was formalized
Growing demands in wideband radio and wireless communication deployments are imposing the necessity of a proper radio architecture capable of providing solid performance, more flexibility, in addition to optimal power, size, and cost.
This paper focuses on how direct RF sampling architecture has proved to be a felicitous approach
Woodcliff Lake, New Jersey — September 5, 2024—Semiconductor intellectual property provider CAST today announced a new serial interface IP core that supports two of the most popular communication protocols: I2C (Inter-Integrated Circuit) and SPI (Serial Peripheral Interface).
The new I2CSPI-CTRL I2C and SPI Controller/Target Controller implements the features of
[September 4, 2023] – Semiconductor Manufacturing International Corporation (SMIC), China’s leading chipmaker, has significantly reduced its capital expenditures (capex) in the first half of 2024, despite a surge in semiconductor equipment spending by China overall.
SMIC’s H1 capex dropped from $12 billion in H1 2023 to $8 billion in H1
WASHINGTON—Sept. 3, 2024—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales hit $51.3 billion during the month of July 2024, an increase of 18.7% compared to the July 2023 total of $43.2 billion and 2.7% more than the June 2024 total of $50.0 billion. Monthly sales are compiled
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Meyreuil, France—September 3, 2024— CoreHW, a leading fabless semiconductor company, and Presto Engineering, a European expert in application specific integrated circuit (ASIC) design, engineering, and production services, have announced their successful collaboration in developing the first enhanced low-power radio frequency (RF) 2.4GHz front-end module in an ultra-small and thin wafer-scale
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