Author Archives: anysilicon

Name: anysilicon

Presto Engineering Joins MEDICALPS Cluster to Support Medical Device Innovations

press release

Meyreuil, France – September 12th – Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, proudly announces becoming member of the MEDICALPS cluster. This initiative is part of Presto Engineering’s ongoing commitment to understanding the challenges and needs of medical device companies, ensuring continued

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Finland: Fab expansion adding 200 mm wafer capacity significantly

chip

Okmetic is currently building a fab expansion, that will more than double our Vantaa site capacity. The fab expansion will be in operation in 2025 and focus on 200 mm crystal growth as well as 200 mm SSP and DSP wafers.
 
Vantaa site in summer 2024
 
In addition

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GaN, from innovation to mass production

The man with a carrier of the silicone wafers

Today, GaN is set to be an indispensable technology for power and RF applications in the coming years. Established Si and SiC companies are eager to enter this emerging market, but moving from innovation to mass production raises significant challenges. Last June, Ezgi Dogmus from Yole Group, along with

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Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design

press release

CAMPBELL, Calif., Sept. 10, 2024 — Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that VeriSilicon (688521.SH), a one-stop custom silicon service and semiconductor IP licensing service provider, has licensed Arteris FlexNoC 5 interconnect IP. This physically aware interconnect IP offers enhanced

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Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology – an industry game-changer

wafer

Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to

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Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets

Examining a microchip

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services – design,

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