Author Archives: anysilicon

Name: anysilicon

Intel and UMC Announce New Foundry Collaboration

SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 – Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile,

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The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

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Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking

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YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona

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SAN RAMON, CA, 94582 — January 17, 2024 — YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona. The Semidynamics High-Performance High-Bandwidth Quad Core IP with 4 Atrevido 423 with V8 SMD VPUs and T16 SMD Tensor

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Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal

TEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.
 
Since February 2023, GF

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HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

haila presto feature

LAS VEGAS—January 8, 2024—Today, HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip solutions for IoT devices, announces availability of the BSC2000 RF Evaluation Chip Development and Demonstration Kits. Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and

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VeriSilicon unveils the new VC9800 IP for next generation data centers

press release

Delivering exceptional throughput, AI-powered encoding, and superb image enhancement for data centers
 
Las Vegas, USA — January 8, 2024 — VeriSilicon (688521.SH) today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications. The newly launched

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