Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
“After a comprehensive investigation on almost all commercial solutions, we concluded that the PVT sensors from Moortec were the best
Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process. Faraday introduced the industry’s first USB
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Last week was the Linley Processors Conference held in Santa Clara, CA. where vendors announced new products and technical details about new network architectures, security implementations, and novel memory devices were disclosed. Session 8 was titled “Open Instruction Sets” and featured a “pro” presentation by Krste Asanović, Professor, University of
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IP-Maker, the leading storage IP startup, will exhibit at Flash Memory Summit in Santa Clara, CA, on August 8 to 10. The next generation of non-volatile memories comes with an access time in the microsecond range. The NVM Express (NVMe) protocol has been introduced in order to minimize the protocol
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An Intellectual Property (IP) core in Semiconductors is a reusable unit of logic or functionality or a cell or a layout design that is normally developed with the idea of licencing to multiple vendor for using as building blocks in different chip designs.
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