Category Archives: Testing

Cyient Semiconductors & Anora Partner to Expand Turnkey Test and Validation Solutions

Conveyor for the production of television sets.

HYDERABAD, India, Sept. 16, 2025  — Cyient Semiconductors, a leader in custom ASIC/ASSP and intelligent power solutions, announced a strategic partnership with Anora, a global provider of semiconductor test, testability, and validation services. The collaboration brings together complementary strengths to provide comprehensive, end-to-end solutions for semiconductor product development.
 
Under this

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The Future of Semiconductors: A Deep Dive with Martin Sallenhag

This interview features Martin Sallenhag, CEO, at RoodMicrotec, part of Microtest Group.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
RoodMicrotec was founded in 1969 and has been a strong partner for European

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FormFactor Named #1 Global Supplier in Test Subsystems and Focused Chip Making Equipment

press release wafer

LIVERMORE, Calif., May 27, 2025 (GLOBE NEWSWIRE) – FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier, has been named the #1 global supplier in both the Test Subsystems and Focused Chip Making Equipment categories in TechInsights’ 2025 global semiconductor industry customer satisfaction survey. The company earned five-star

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Wafer Testing: Ultimate Guide

wafer

What Is Wafer Testing?
 

 
Wafer testing—often called wafer sort or probe testing—is the process of electrically evaluating individual semiconductor dies directly on the wafer. Using precision probe needles to make contact with bond pads or dedicated test structures, wafer testing allows engineers to:
 

Verify Device

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Wafer Probe: The Ultimate Guide

wafer sort feature

What Is Wafer Probe?
 

 
Wafer probe (or wafer probing) refers to the electrical testing of semiconductor dies while they are still part of the wafer. By using microscopic probe needles to contact bond pads or built-in test points on each die, engineers can:
 

Verify functionality:

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The Future of Semiconductors: A Deep Dive with Scott Bulbrook

deep dive da-integrated feature

This interview features Scott Bulbrook, President of DA-Integrated.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services

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