Category Archives: IP Cores

YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI

news

SAN RAMON, CA, UNITED STATES, February 19, 2025 — YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, power and latency and targets edge AI applications as well as Data Center Accelerator

Read More

Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP

press release

CAMPBELL, Calif., February 18, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation

Read More

Thalia Announces Latest Version of AMALIA with Game-Changing ‘Device-Stretching’ Algorithm and Flip Well Intelligence

press release

Cwmbran, United Kingdom– 11/02/2025 – Thalia Design Automation is thrilled to announce the immediate availability of the latest version of the AMALIA Suite, their AI-powered industry end-to-end IP reuse platform. 
 
This release brings significant enhancements throughout AMALIA, particularly within its Layout Automation Suite.  The solution retains the intrinsic value

Read More

Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design

Press Release PR

ATLANTA, GA, February 10, 2025 – Silicon Creations, a leading provider of high-performance analog and mixed-signal intellectual property (IP), today announced the successful tape-out of a chip on the TSMC N2P process including a novel temperature sensor design and an expanded portfolio of clocking IP to support next-generation semiconductor products.
 
Read More

EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

news

Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process

Read More

Memorandum of Understanding to Develop AI Acceleration Technologies

red semi and codasip

Munich, Germany, and Oxford, UK – 28th January, 2025 — Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
 
Under the MoU, RED will leverage the Codasip Studio processor design tools to integrate its VISC technology as an accelerator for Codasip

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.