IP Cores Archives - Page 25 of 54

Enabling security in embedded system using M.2 SSD

Storage technologies are evolving at a high speed, thanks to new generations of memories such as Nandflash, ReRAM, MRAM and other flavors. That leads in an incredible performance increase in term of bandwidth and latency. By the way, security and data privacy features are still an important feature for critical

Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip

Moortec, the go-to leaders of innovative in-chip technologies, today announced that Uhnder’s new automotive radar-on-chip (RoC) uses Moortec’s complete embedded monitoring subsystem solution to optimise the performance and reliability of their innovative Digital Automotive Radar-on-Chip device.

Austin-based Uhnder has produced the first ever digital radar-on-chip which offers smaller size,

Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications

SAN JOSE, Calif.– November 20, 2019 –Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced that Alereon, a leader in Ultra-Wideband solutions, has adopted Omni Design’s Analog-to-Digital (ADC) and Digital-to-Analog (DAC) Converters sampling at greater than 1GSPS for its next generation UWB chipset.
“We

Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”

Hsinchu, Taiwan, – Nov 20, 2019 — Attopsemi Technology attended SOI Symposium on October 30th, 2019 in Yokohama, Japan and provided a talk “I-fuse™: A Disruptive OTP Technology”. The event was a huge success and attracted several hundreds of attendees.

In a well-received speech during the EDA/IP Session, Shine Chung,

Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

Faraday Technology Corporation(TWSE: 3035), a leading ASIC design service and IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt

SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

SmartDV™ Technologies will exhibit at SemIsrael Expo 2019 in Airport City, Israel, November 19 and ICCAD China 2019 November 21-22 in Nanjing, China.

At both events, SmartDV will showcase why it is the Proven and Trusted choice for Verification and Design Intellectual Property (IP), including new additions to its

Category Archives: IP Cores

Enabling security in embedded system using M.2 SSD

Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip

Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications

Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”

Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

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Category Archives: IP Cores

Enabling security in embedded system using M.2 SSD

Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip

Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications

Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”

Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

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