Category Archives: IP Cores

Memorandum of Understanding to Develop AI Acceleration Technologies

Munich, Germany, and Oxford, UK – 28th January, 2025 — Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
 
Under the MoU, RED will leverage the Codasip Studio processor design tools to integrate its VISC technology as an accelerator for Codasip

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Plexus and intoPIX Expand IPMX Solutions Offering

press release

Mont-Saint-Guibert, Belgium, January 28, 2025 – intoPIX, a leading provider of innovative image compression technologies, and PlexusAV, a pioneer in IPMX solutions, are proud to announce the successful interoperability testing between the Plexus P-AVN-4 IPMX JPEG XS FIP transceiver and the new intoPIX Titanium Software Suite. This collaboration highlights the

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Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X

SUNNYVALE, Calif., Jan. 21, 2025 /PRNewswire/ — Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while

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Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

SAN JOSE, Calif.— January 21, 2025 — Cadence (Nasdaq: CDNS) today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will

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CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core

press release

Woodcliff Lake, New Jersey — January 16, 2025—CAST, a leading semiconductor intellectual property (IP) core provider, is excited to announce the upcoming release of its new KiviPQC™-KEM IP core and invites early adopters to engage in product evaluations. This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as

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YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet

SAN RAMON, CA, UNITED STATES, January 14, 2025 — YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in open market as Chiplets. Designers currently have to license the IP and integrate into a custom SOC while

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