June 9, 2025 —- TrendForce’s latest investigations find that the global foundry industry recorded 1Q25 revenue of US$36.4 billion—a 5.4% QoQ decline. The downturn was softened by last-minute rush orders from clients ahead of the U.S. reciprocal tariff exemption deadline, as well as continued momentum from China’s 2024 consumer subsidy program.
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MALTA, N.Y., June 4, 2025 – GlobalFoundries (Nasdaq: GFS) (GF), working with the Trump Administration and with support from leading technology companies aiming to onshore critical components of their supply chain, today announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its facilities
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June 2, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced that it is in advanced discussions to evaluate the feasibility of establishing a state-of-the-art “gigafab” production complex in the United Arab Emirates (UAE). If realized, this facility would be similar in scale to TSMC’s
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May-30-2025 — Despite making progress at older manufacturing nodes like 7nm and 8nm—with Nintendo reportedly among its clients—Samsung continues to face serious issues at the leading edge. Three years into mass production, its 3nm yield remains stuck around 50%, according to South Korean news outlet Chosun Biz.
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Munich, Germany – May 28, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC) today announced the establishment of its inaugural European Design Center, set to commence operations in Munich during the third quarter of 2025. This strategic move underscores TSMC’s commitment to supporting European clients in developing high-density, high-performance, and energy-efficient
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SINGAPORE, 20 MAY 2025 – GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
Advanced packaging has become