Category Archives: Wafer and Foundries

Perceptia Joins GLOBALFOUNDRIES Events in Santa Clara, Munich

August 14, 2019, anysilicon

Perceptia Devices, Inc. and GLOBALFOUNDRIES have agreed that Perceptia will join GLOBALFOUNDRIES in Santa Clara, California, on September 24, 2019, and in Munich, Germany, on October 11, 2019. GLOBALFOUNDRIES will hold its Technology Conference (GTC) in these locations, and Perceptia will be pleased to present its first three IPs available

Read More

Can We Believe The Hype About China’s Domestic IC Production Plans?

June 18, 2019, anysilicon

In the wake of tariffs and trade tension between China and the United States, government officials and company representatives throughout China have doubled down on their resolve to quickly and meaningfully grow the nation’s domestic IC business in order to reduce its dependence on critical IC components currently supplied by

Read More

Chinese Semiconductor Foundry SMIC to Delist From NYSE

May 26, 2019, anysilicon

China’s biggest semiconductor foundry is to withdraw from the New York Stock Exchange. SMIC notified the NYSE of its intention to apply on June 3 to delist its American depositary receipts (ADRs) from the bourse.
SMIC cited “a number of considerations,” including the limited trading volume of its ADSs

Read More

ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility

April 22, 2019, anysilicon

PHOENIX & SANTA CLARA, Calif.–(BUSINESS WIRE)–Apr 22, 2019–ON Semiconductor Corporation (Nasdaq: ON ) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of

Read More

TSMC and OIP Ecosystem Partners Deliver Industry’s First Complete Design Infrastructure for 5nm Process Technology

April 04, 2019, anysilicon

TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets. Leading Electronic Design Automation (EDA)

Read More

Number of 300mm Semiconductor Fabs Expected to Reach 121 in 2019

March 20, 2019, anysilicon

IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2023. The newest edition of the Global Wafer Capacity report shows that 300mm wafers took over as the industry’s primary wafer

Read More