May 15, 2018, anysilicon
Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, today announced that it has joined GLOBALSOLUTIONS®, GF’s ecosystem of partners that providesservices from conception to production. As an ecosystem partner, Presto will provide its post-silicon engineering and production turnkey solutions based upon GF’s technologies and
Read MoreMay 11, 2018, anysilicon
The spread of digital camera applications in vehicles, machine vision, human recognition and security systems, as well as for more powerful camera phones will drive CMOS image sensor (CIS) sales to an eighth straight record-high level this year with worldwide revenues growing 10% to $13.7 billion, following a 19% surge
Read MoreMay 01, 2018, anysilicon
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and Avnet ASIC Israel Ltd. (AAI), a leading provider of ASIC and System on Chip (SoC) design solutions and turn-key design services, has announced a strong partnership in the fields of ASIC design and manufacturing services. This collaboration will
Read MoreApril 25, 2018, anysilicon
Research included in the recently released 50-page April Update to the 2018 edition of IC Insights’ McClean Report shows that in 2017, the top eight major foundry leaders (i.e., sales of ≥$1.0 billion) held 88% of the $62.3 billion worldwide foundry market (Figure 1). The 2017 share was the same level as in 2016
Read MoreApril 23, 2018, anysilicon
CMOS image sensor (CIS) sales are on pace to reach a seventh straight record high this year and nothing ahead should stop this semiconductor product category from breaking more annual records through 2021 (Figure 1), according to IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes.
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April 03, 2018, anysilicon
The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using
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