April 22, 2019, anysilicon
PHOENIX & SANTA CLARA, Calif.–(BUSINESS WIRE)–Apr 22, 2019–ON Semiconductor Corporation (Nasdaq: ON ) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of
Read MoreApril 04, 2019, anysilicon
TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets. Leading Electronic Design Automation (EDA)
Read MoreMarch 20, 2019, anysilicon
IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2023. The newest edition of the Global Wafer Capacity report shows that 300mm wafers took over as the industry’s primary wafer
Read MoreFebruary 28, 2019, anysilicon
The IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer Capacity 2019-2023 report, IC Insights shows that due to the surge of merger and acquisition activity in the
Read MoreFebruary 27, 2019, anysilicon
The advancement of the semiconductor industry hinges on the ability of IC manufacturers to continue offering more performance and functionality for the money. As mainstream CMOS processes reach their theoretical, practical, and economic limits, lowering the cost of ICs (on a per-function or per-performance basis) is more critical and challenging
Read MoreFebruary 01, 2019, anysilicon
The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies.
However, since the 1980s, the long-term trend has been toward a
