SANTA CLARA, Calif.– April 23, 205 –TSMC (TWSE: 2330, NYSE: TSM) today unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power
Read MoreIn the realm of cutting-edge electronics, the shift from silicon-based components to gallium nitride (GaN) technology is making waves across industries. As traditional semiconductors reach their performance limits, GaN High Electron Mobility Transistors (HEMTs) offer a compelling alternative with superior efficiency and enhanced thermal management. Whether you’re an engineer diving
Read MoreHsinchu, Taiwan, R.O.C., April 17, 2025 — TSMC today announced consolidated revenue of NT$839.25 billion, net income of NT$361.56 billion, and diluted earnings per share of NT$13.94
(US$2.12 per ADR unit) for the first quarter ended March 31, 2025. Year-over-year, first quarter revenue increased 41.6%, while net income and diluted
April-1, 2025 — United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced the official opening of its new 22nm wafer fabrication facility (fab) in Singapore’s Pasir Ris Wafer Fab Park. The grand opening ceremony was attended by high-ranking Singaporean officials, including Deputy Prime Minister Gan Kim Yong and
Read MoreCadence is expanding its collaboration with Intel Foundry by officially joining the Intel Foundry Accelerator Design Services Alliance! This collaboration amplifies both companies’ efforts to drive innovation, support advanced chip design, and solidify Intel Foundry as a leader in cutting-edge semiconductor solutions.
Cadence’s inclusion in this ecosystem accelerates innovation by offering
CAMBRIDGE, UNITED KINGDOM — March 5, 2025 — Pragmatic Semiconductor Ltd., a pioneer in flexible semiconductor technology, today announced the launch of Pragmatic FlexIC Platform Gen 3, offering a 10x digital power and 3x digital area improvement over the previous generation.
The platform comprises a process design kit (PDK) –