Category Archives: Wafer and Foundries

Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies

Aug-27th 2024, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s

Global Foundry Industry’s Revenue Rises on AI Demand

The global foundry industry’s revenue grew about 9% QoQ and 23% YoY in Q2 2024, according to Counterpoint Research’s Foundry Quarterly Tracker. The sequential growth was mainly driven by strong AI demand. CoWoS supply remained tight, with potential upsides in capacity expansions focusing on CoWoS-L going forward. Despite slower demand

UMC’s Singapore Fab 12i Celebrates First Tool Move-In for New Phase 3 Expansion

United Microelectronics Corp (UMC), Taiwan’s second-largest pure-play wafer foundry, marked a milestone yesterday with the arrival of the first equipment tools for its Phase 3 expansion at Fab12i in Singapore. The ceremony was attended by representatives from the Singapore Economic Development Board (EDB), Jurong Town Council (JTC), the Institute of

TSMC Acquires Innolux Plant to Boost AI Chip Packaging Capacity

Taipei, August 16 – Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, has announced the purchase of a plant and equipment from flat panel maker Innolux Corp. for NT$17.14 billion (US$531 million). The acquisition, located in the Southern Taiwan Science Park, encompasses a 317,445 square meter facility and related

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores

The Ultimate Guide to: BCDMOS

BCDMOS, short for Bipolar-CMOS-DMOS, is a type of semiconductor process that amalgamates three pivotal technologies—Bipolar, CMOS, and DMOS—into a single chip. This remarkable fusion confers unique advantages that have propelled it to a pivotal position in the electronics industry.
 

Image source: ST Microelectronics
 
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