Category Archives: Wafer and Foundries

Pure-Play Semiconductor Foundry Market Growth By Region 2017-2018

IC Insights’ September Update to The McClean Report shows that as a result of a 51% forecasted increase in the China pure-play foundry market this year (Figure 1), China’s total share of the 2018 pure-play foundry market is expected to jump by five percentage points to 19%, exceeding the share held by the rest

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Wafer Fabs Around the World – Interactive Map

 

Wafer fabrication facilities, commonly known as wafer fabs, are the backbone of the semiconductor industry. These highly specialized factories process silicon wafers into integrated circuits (ICs) used in nearly every electronic device today. Let’s take a closer look at the global distribution and

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GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings

globalfoundries

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients

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Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications

Silicone wafers in a carrier

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it is leveraging Samsung FinFET platforms to extend its ASIC design solutions in next-generation applications, such as artificial intelligence (AI), 5G/infrastructure networking, blockchain, cloud storage, high-performance computing (HPC), AR & VR, and high-end imaging.
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IBM and Synopsys Accelerate 3nm Process Development with DTCO Innovations

The man with a carrier of the silicone wafers

Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the pathfinding of new semiconductor process technologies for the 3-nanometer (nm) process node and beyond. DTCO is a methodology for efficiently evaluating and down-selecting new transistor architectures, materials and other process technology innovations

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TSMC Details Impact of Computer Virus Incident

TSMC

Hsinchu, Taiwan, R.O.C., Aug 5, 2018 – TSMC today provided an update on the Company’s computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan. The degree of infection varied by fab. TSMC contained the problem and found a solution.

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