CMOS image sensor (CIS) sales are on pace to reach a seventh straight record high this year and nothing ahead should stop this semiconductor product category from breaking more annual records through 2021 (Figure 1), according to IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes.
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The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using
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GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFwave™, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.
The last few years there has been an increasing demand for connected devices and systems that will require innovations in
TSMC has recently updated its VCA (Value Channel Aggregator) program so we thought it would be beneficial to review TSMC VCA program and update our readers with the program benefits and value proposition.
As you all know — TSMC is a pure-play foundry and as such, it’s offering wafer
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology
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The success and proliferation of integrated circuits (IC) has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab
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