TSMC has recently updated its VCA (Value Channel Aggregator) program so we thought it would be beneficial to review TSMC VCA program and update our readers with the program benefits and value proposition.
As you all know — TSMC is a pure-play foundry and as such, it’s offering wafer
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology
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The success and proliferation of integrated circuits (IC) has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab
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Semiconductor industry wafer capacity, specifically in the memory segment, was inadequate to meet demand throughout 2017. However, with Samsung, SK Hynix, Micron, Intel, Toshiba/WD, and XMC/Yangtze River Storage Technology planning to significantly ramp up 3D NAND flash capacity over the next few years, and Samsung and SK Hynix boosting DRAM
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CPUs are the heart of all the mobile devices we use today, and their performance is paramount to product design and user experience. More efficient processors can lead to more powerful products while maintaining low power consumption. One of the world’s largest chip manufacturers (and consequently processors), TSMC, which manufactures
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IC Insights has revised its outlook for semiconductor industry capital spending and will present its new findings in the November Update to The McClean Report 2017, which will be released at the end of this month. IC Insights’ latest forecast now shows semiconductor industry capital spending climbing 35% this year to $90.8 billion.
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