UMC’s CEO, Po-Wen Yen, confirmed the drop of 5% on wafer shipment performance for the third quarter of 2015. The CEO justified this forecast by referring to a restricted market visibility and to weaknesses in the demand due to the uncertain economic environment. Not only, Po-Wen-Yen mentioned also the inventory
Read More
I recently read an interesting article “Intel’s cost cuts could give rivals higher ground: analysts” where the analysis claims that Intel Corp’s move to delay the launch of its next generation chip technology to 2017 may see the company lose ground to rivals Taiwan Semiconductor Manufacturing Co and Samsung Electronics
Read More
Taiwan Semiconductor Manufacturing Company (TSMC) has dropped its prices on 28nm and 20nm process technologies by 5-10% in hopes to secure additional orders from major companies which includes Qualcomm and MediaTek, according to DigiTimes. However, the reaction of 28nm prices will most likely affect AMD and Nvidia positively, who are
Read More
Multi Project Wafer (MPW) emerged in the 1970’s to help companies and researchers prototype their silicon and demonstrate their work. It was the early days of the semiconductor industry when firms like Fairchild, IBM and others were applying technology innovation to create smaller, faster and cheaper chips. Back then, Multi-Project
Read More
The world’s largest contract chip maker, Taiwan Semiconductor Manufacturing Co (TSMC), is being expected to secure more than half of all of Apple’s new mobile chip in 2016. This is due to their better production roadmap planning. They’re expecting that since the Taiwanese manufacturer has a clear roadmap for their
Read More
The war between TSMC and Samsung is heating up and it’s expected to last well throughout the decade. The war only got hotter when TSMC announced that they will begin producing 7nm processors in 2017. Xilinx will be their very first customer.
Xilinx Inc. made the announcement late yesterday that
