The semiconductor industry is poised for a significant expansion in 2025, with plans to commence construction on 18 new fabrication plants (fabs). This surge, detailed in SEMI’s World Fab Forecast, reflects the industry’s projected growth to $697 billion in 2025, an 11.2% increase from 2024. While some fabs are slated for production in 2026 or 2027, market conditions could impact project timelines or lead to cancellations. The high cost of building and equipping advanced fabs—ranging from $10 billion to $20 billion—underscores the substantial investment commitment. Currently, the industry operates 167 fabs processing 300mm wafers and 224 200mm fabs globally. SEMI’s forecast projects the launch of 97 new high-volume fabs between 2023 and 2025, including 32 in 2025 alone.
Key Players, Locations, and Detailed Schedules:
The 2025 expansion will see major players like Micron, Intel, SK Hynix, SMIC, TSMC, and GlobalFoundries initiating new fab projects. The geographic distribution and project specifics are detailed below:
Americas (4 Projects):
- GlobalFoundries Fab 8.2 (Malta, NY): A 300mm foundry fab. While the exact start date for volume production isn’t publicly specified, the commencement of construction in 2025 suggests a likely operational start sometime in 2027.
- Intel D1X module 4 (Hillsboro, OR): A 300mm logic/foundry fab. Similar to GlobalFoundries, the precise operational start date remains undisclosed, but a 2025 construction start points towards a 2027 or later launch.
- Micron (Clay, NY): A 300mm DRAM fab. Micron has been relatively tight-lipped about specific timelines, but the 2025 construction start indicates a likely operational timeframe of 2027 or later.
- [Unspecified Location/Company]: One additional project is planned for the Americas, but details regarding location and the specific company remain undisclosed at this time.
Japan (4 Projects):
- Sony (Kumamoto): A CMOS image sensor fab. Further details on the precise schedule are unavailable.
- Toshiba (Nomi-shi, Ishikawa Prefecture): A 300mm power semiconductor fab. Specific timelines for completion and production remain undisclosed.
- TSMC Fab 23 phase 2 (Kumamoto): A 300mm foundry fab. While TSMC is known for its aggressive expansion plans, precise dates for this phase remain confidential.
- UMC (Mie): A 300mm foundry fab. Details on the exact production start date are not publicly available.
China (3 Projects):
- CanSemi Phase 4 (Guangzhou): A 300mm foundry fab. Precise operational start dates remain unannounced.
- CXMT Fab 3: A 300mm DRAM fab. Specific timelines are not yet public.
- SMIC Fab 10 phase 2: A 300mm foundry fab. Similar to other projects, the exact operational start date is not disclosed.
Europe/Middle East (3 Projects):
- GlobalFoundries (Dresden, Germany): A 300mm foundry fab. The projected operational start is likely sometime in 2027, given the 2025 construction start.
- OnSemi (Roznov, Czech Republic): A 200mm silicon carbide (SiC) wafer and epi fab. Specific production timelines are not publicly available.
- [Unspecified Location/Company]: One additional project is planned for the Europe/Middle East region, but details regarding location and the specific company are currently unavailable.
Taiwan (2 Projects):
- TSMC Fab 20 P3 (Hsinchu): A 300mm foundry fab. Exact operational dates are not publicly released.
- TSMC Fab 22 P3 (Kaohsiung): A 300mm foundry fab. Specific production start dates are not available.
South Korea (1 Project):
- SK Hynix (Yongin): A 300mm DRAM/HBM fab. The exact operational start date is not yet public.
Southeast Asia (1 Project):
- FT1 (Lamphun, Thailand): A 200mm SiC fab. Specific production timelines are not publicly available.
Fab Types and Timelines:
The 18 new fab construction projects starting in 2025 comprise three 200mm fabs and fifteen 300mm facilities. Most are anticipated to commence operations between 2026 and 2027, highlighting the substantial lead time required for construction and commissioning. SEMI analyst Christian Dieseldorff emphasizes the 1.5 to 2-year timeframe from construction start to volume production. However, it’s crucial to note that these are projections, and actual timelines may vary based on various factors.
A Note on Stability:
While the number of new fab construction projects remains relatively stable compared to 2024 (19 projects), the global distribution and diverse technological focus (DRAM, logic, foundry, and specialized silicon carbide fabs) demonstrate a continued commitment to semiconductor manufacturing expansion despite potential economic headwinds. The industry’s strategic investments underscore its confidence in long-term growth and the enduring demand for advanced semiconductor technologies.
