For clarification of some the topics addressed above:
Bin: a bin is a grouping of a test the simple form is pass vs. fail, but also continuity are used. Subclasses of pass bins is often used. It can be on sensitivity, speed or other parameters. Bin classes can both be SW bins and HW bins.
Ink of wafers. IT is an old technology which is seldom used today. Electronic wafer maps is preferred.
Wafer maps: Wafer maps is not only provided at electronic test, it is often also inspection maps e.g. bump inspection maps or exclusion maps. Those maps is merged together to give a test map or a P&P map.
Henrik