Dresden, Germany – November 1st 2025 – GlobalFoundries (NASDAQ: GFS) today announced a major investment of €1.1 billion (approximately US$1.27 billion) to expand its manufacturing capabilities at its Dresden, Germany facility. The expansion, known as Project SPRINT, will enable production capacity of more than one million wafers per year by the end of 2028, reinforcing Dresden’s position as one of Europe’s most advanced semiconductor manufacturing hubs.
As part of the plan, the Dresden facility will be upgraded to deliver end-to-end European processes and secure data flows to meet growing requirements for semiconductor security and sovereignty. The investment is expected to be supported by the German federal government and the State of Saxony under the framework of the European Chips Act, with full EU approval anticipated later this year.
The expanded manufacturing capacity will focus on GlobalFoundries’ differentiated technologies, including low-power, embedded secure memory and wireless connectivity, which are essential for automotive, IoT, defense, and critical infrastructure applications.
“We are reinforcing Europe’s semiconductor supply-chain resilience by scaling our manufacturing footprint,” said Tim Breen, CEO of GlobalFoundries. “This investment strengthens our ability to serve European and global customers with secure, energy-efficient semiconductor technologies.”
Chancellor Friedrich Merz welcomed the investment, stating:
“The SPRINT project is a commitment to Germany as an industrial and innovation location – and above all to the sovereignty of our country and Europe. The investment in chip manufacturing in Dresden sends a strong signal that Germany wants to play an active role in shaping the development of the global semiconductor market.”
GlobalFoundries’ Dresden facility currently manufactures wafers on multiple technology platforms, including 22 nm FD-SOI, nonvolatile memory, high voltage, and BCD technologies, with process nodes ranging from 22 nm to 55 nm. These platforms serve diverse markets such as automotive, IoT, and smart mobile devices.
Earlier this year, GF also announced plans to invest US$16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its New York and Vermont facilities. Together, these initiatives represent one of the largest global expansions in the company’s history.
Under Project SPRINT, construction and clean-room expansion at Dresden will proceed throughout the next three years, with capacity ramp-up targeted toward late 2028. GF expects regulatory support and funding under the European Chips Act framework to be confirmed in due course.
“With this expansion, we are deepening our commitment to Europe and ensuring that our customers can rely on a resilient, local supply of advanced semiconductors,” added Breen.
