Tel Aviv, Israel — November 5, 2025 — RAAAM Memory Technologies, an Israeli semiconductor startup developing next-generation on-chip memory, today announced it has raised $17.5 million in an oversubscribed Series A funding round led by NXP Semiconductors.
The round also saw participation from a leading multinational networking corporation, IAG Capital Partners, the European Innovation Council (EIC) Fund, LiFTT, Alumni Ventures, and all existing investors — J-Ventures, Silicon Catalyst Ventures, and Serpentine Ventures. This new funding brings RAAAM’s total capital raised to over $24 million, including equity investments and a grant from the prestigious EIC Accelerator program.
The fresh capital will be used to qualify RAAAM’s patented GCRAM (Granular Capacitor RAM) technology on advanced process nodes across multiple top-tier foundries. The company has already demonstrated its memory technology on silicon and recently entered a strategic collaboration with NXP.
“This oversubscribed funding round with high-profile strategic and financial investors is another sign of confidence in our company and our revolutionary technology,” said Robert Giterman, CEO and Co-Founder of RAAAM Memory Technologies. “Our solution promises to overcome the memory bottleneck in leading-edge AI chips by offering significant density improvements and lower power consumption compared to SRAM.”
Eli Leizerovitz, Chief Business Officer at RAAAM, added:
“The backing from NXP and a global networking leader validates the strong market need for our memory innovation. We’re now positioned to accelerate engagements with leading semiconductor companies and foundries, aligning closely with our customers’ product roadmaps.”
Victor Wang, Vice President of Front-End Innovation at NXP Semiconductors, commented:
“We’ve collaborated with RAAAM for several years and have seen first-hand the potential of their on-chip memory technology. Their solution directly addresses one of the most critical challenges in advanced chip design, and we believe it can deliver significant density and power advantages across multiple applications.”
Svetoslava Georgieva, Chair of the EIC Fund Board, emphasized the technology’s strategic value:
“RAAAM’s breakthrough in on-chip memory directly addresses a critical gap in the semiconductor value chain. We’re proud to support their journey from proven prototypes to market-ready solutions.”
Founded in 2021, RAAAM Memory Technologies is headquartered in Israel with an R&D center in Switzerland. Its GCRAM product delivers up to 50% area reduction and up to 10x lower power consumption than high-density SRAM, while remaining fully compatible with standard CMOS processes, enabling seamless integration by chipmakers worldwide.
