Semiconductor Latest News

How to Choose the Right Arm CPU Core for ASIC

Choosing an Arm CPU core starts with the workload, not with the processor name. The right core depends on what the chip must do, the software it must run, the power and area available, whether deterministic real-time behavior is required, and how much performance the system actually needs. Arm offers

MPW Run: Cost, Schedule & Booking Tool

An MPW run is one of the most cost-effective ways to manufacture first silicon when you do not yet need a full dedicated wafer lot. MPW stands for Multi-Project Wafer. Instead of one customer paying for the entire mask set and wafer fabrication process, multiple IC designs share

TSMC MPW: CyberShuttle, Cost, Schedule & Access

TSMC MPW gives chip designers a lower-cost way to manufacture first silicon on TSMC technology without paying for an entire dedicated mask set and wafer run. TSMC operates its multi-project wafer program under the name CyberShuttle®. Several customer designs share the same multi-project mask set, which spreads tooling and wafer

High-end packaging: a market set to nearly quintuple by 2031

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during 2025-2031, with package unit volume expanding at a 33% CAGR and wafer demand at 30%.

IC Prototype Packaging: Options, Cost & Suppliers

IC prototype packaging is the bridge between first silicon and a device that engineers can actually handle, mount on a PCB and evaluate. For most prototype ASICs, sensors, mixed-signal ICs and MPW shuttle dies, the best approach is to use an existing package platform such as QFN, QFP, BGA or

Silicon Interposer vs Organic Interposer vs Glass Interposer: Which Is Best?

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, proven HBM integration and the most demanding chiplet-to-chiplet bandwidth are required; organic or RDL interposers are usually more attractive when cost, large package size and mechanical compliance matter more than absolute interconnect density; and glass

2.5D vs 3D Packaging: What Is the Difference?

The practical difference is simple: 2.5D packaging places multiple dies side-by-side and connects them through a high-density interposer or bridge, while 3D packaging stacks dies vertically and connects them through TSVs, microbumps or hybrid bonding. In 2026, 2.5D remains the mainstream architecture for large AI accelerators, GPUs and HBM-based systems

VQFN Package: What It Is, Sizes, Price & PCB Design

VQFN stands for Very Thin Quad Flat No-Lead, and it is best understood as a low-profile member of the QFN family rather than a fundamentally different package architecture. Like a standard QFN, a VQFN has no protruding gull-wing leads; the electrical terminals are located mainly on the bottom perimeter

QFN vs QFP: What Is the Difference and Which Package Should You Choose?

QFN is usually the better choice when your priorities are minimum PCB area, short electrical paths, RF/high-frequency performance and efficient heat transfer into the PCB; QFP is usually the better choice when visible solder joints, easier optical inspection, probing and rework are more important. The fundamental difference is mechanical:

BGA Packaging Services – Find BGA Assembly Companies

Looking for a BGA packaging company for prototype, low-volume or production semiconductor assembly?
 

AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering wire-bond BGA, flip-chip BGA, FCBGA, FBGA and custom substrate-based packaging services worldwide.
 
Submit your die, substrate, package, ball-count and production-volume requirements and