Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
The market for Bluetooth low energy devices is expected to reach 1.4 Billion, growing at a CAGR of 34% between 2015 to 2021, as per ABI Research. While investments in Internet-of-Things (IoT) technology are ever increasing, there are many wireless technologies such as Zigbee, Wi-Fi, Bluetooth and Z-wave competing for
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Dolphin Integration, leader in innovative design solutions for the next generation of Energy-Efficient System-on-Chips, augments TSMC’s IP ecosystem at 40 nm with TITAN, a breakthrough architecture for Read Only Memory compiler. This cost effective, single-layer and late programmable ROM compiler is capable of generating instance sizes from 512 bits to
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Codasip, the leading supplier of RISC-V® embedded processor intellectual property, today announced that Jerry Ardizzone has joined as Vice President of Worldwide Sales, reporting to CEO Karel Masařík.
“We are very excited to have Jerry on board to lead our global sales efforts,” declared Karel Masařík, CEO and founder
Semiconductor intellectual property provider CAST, Inc. has taken advantage of a new cloud-based FPGA accelerator marketplace developed by Accelize®to make industry-leading GZIP data compression available to users and developers whenever they need it.
The new AccelStore™makes critical functions like GZIP directly available to end users on a rental by
This interview was help with Stefano Perticaroli, Ph.D. Eng., CEO at Radio Analog Micro Electronics srl.
Tell me a bit about your background? How did you first get started with Radio Analog Micro Electronics?
I completed my Ph.D in Electronics Engineering at DIET Sapienza Università di Roma
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
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The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using
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Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at Design & Reuse IPSoC 2018 on 5th April in Santa Clara, California. Sankalp Semiconductor’s booth will be displaying expertise related to the digital, analog and mixed signal, custom layout, standard
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IP-Maker is introducing a new product line of NVMe Host IPs. In addition to the Easy NVMe Host IP, targeting embedded applications and launched in 2017, today IP-Maker announces the availability of two new products targeting data center applications: the Advanced NVMe Host IP, and the Multi Root NVMe Host
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Many IC designers pay little attention to ASIC qualification and consequently pay high price and delays before the chip reaches to high volume. The mindset of experienced IC designers is considering IC quality (and reliability) through all phases of the IC design process. Today, more than ever, re-tapeout is costly
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