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Inomize, one of the global ASIC Design Services leader has joined the Arm Approved Design Partner program . The program provides users of the Arm® DesignStart™ initiative with a global list of audited design houses offering expert support during the development of SoC designs.
“Inomize is thrilled to join the Arm
IC Insights will release its 200+ page Mid-Year Update to the 2018 McClean Report next month. The Mid-Year Update will revise IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in the 2018 McClean Report issued in January of this year.
Figure 1 shows that IC Insights forecasts that China-headquartered companies will spend
Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced today that its SerDes (Serializer/Deserializer) receive and transmit PMA (Physical Media Attachment) technology has been deployed in an SoC that powers a leading 8K (UHD) flat-panel television.
The SoC was designed by Socle, an IC ODM
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today at 55th DAC 2018 announced the availability of Sankalp Automated Validation Environment (SAVE). Sankalp will be demonstrating a video demo of the solution at its booth #2457. SAVE allows post-silicon validation of Analog
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Managing an end-to-end ASIC supply chain process is one of the biggest challenges of chip projects. The semiconductor value chain, which has always been complex, does not seem to get any simpler. A McKinsey report pointed out “there has been a 50 percent increase in test and verification time during
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Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area
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This interview was conducted with Udi Shaked, CEO of Inomize.
Full Name: Udi Shaked
Title: CEO
Company: Inomize
Tell me a bit about your background. How did you first get started with Inomize?
We came up with the idea of launching Inomize back in 2007,
The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
The first eWLB package was used in mobile phones in 2009 and since
T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the
ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to
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