Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Presto Engineering Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, and Maja Systems, a world-leading designer of millimeter wave (mmWave) connectivity and sensing solutions, jointly announce their successful collaboration in comprehensive wafer-level ATE for the Maja AirData™ family of terabit connectivity and data transport solutions.
Read More
Moortec, providers of In-Chip Monitoring PVT Subsystems solutions are pleased to announce that Canaan-Creative have employed Moortec’s In-Chip Monitoring Subsystem in their HPC IC.
Canaan-Creative is a worldwide leader in the design of high performance computing IC. “We have compared performance from other companies with Moortec’s and find that PVT
Silvaco today announced that it has acquired NanGate, a leader in Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.
NanGate’s Library Creation Platform has been deployed by a large number of semiconductor companies creating standard cell libraries
TSMC has recently updated its VCA (Value Channel Aggregator) program so we thought it would be beneficial to review TSMC VCA program and update our readers with the program benefits and value proposition.
As you all know — TSMC is a pure-play foundry and as such, it’s offering wafer
This interview was held with Scott Bulbrook, Managing Partner, VP of Engineering at DA-Integrated.
Tell me a bit about your background? How did you first get started with DA-Integrated?
I have always had a passion for the semiconductor industry. At university Semiconductor Physics was my favorite course. I
Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six
Read More
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology
Read More
G-ray Medical Sàrl, a Neuchâtel startup, is currently developing an ultra-high performance detector dedicated to medical applications and in particular mammography. These ultra-high performance detectors will be made in partnership with CSEM, based on G-ray’s revolutionary lateniumTM technology. Centred on particle-counting X-ray imaging, this unique solution is set to improve
Read More
Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES’s 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.
The SoC was created in close cooperation with Arm, ArterisIP, Cadence, GLOBALFOUNDRIES, and INVECAS as part
This is an interview with Claude Joseph Cloutier, President and Chief Executive Officer with XtremeEDA Corporation.
Tell me a bit about your background? How did you first get started with your XtremeEDA?
I started out my work career in 1978 as an Air Navigator in the Canadian Air Force