Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Despite the common belief, OSAT (Outsourced Semiconductor Assembly and Test) companies are very innovative. Many look at TSMC or Synopsys and consider their R&D work as innovative. But actually, semiconductor assembly industry is as innovative as any other company in the industry. We just don’t hear about it.
Semiconductor
Semiconductor industry wafer capacity, specifically in the memory segment, was inadequate to meet demand throughout 2017. However, with Samsung, SK Hynix, Micron, Intel, Toshiba/WD, and XMC/Yangtze River Storage Technology planning to significantly ramp up 3D NAND flash capacity over the next few years, and Samsung and SK Hynix boosting DRAM
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espite consumer media highlighting some of the more ludicrous “innovations” of the Internet of Things (IoT), including wirelessly connected toothbrushes and cocktail stirrers, the industrial market is forecast to be the largest adopter of the IoT “connected” phenomenon. Germany’s Industry 4.0 initiative is an influential driver in the manufacturing sector,
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How many ASIC supply chain providers are typically included in a shortlist when launching a project?
We’d argue that too few.
There are over 100 ASIC supply chain providers worldwide that provide a range of services in different domains– ASIC supply chain for low volume, high volume, automotive, industrial,
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today announced opening of a new design center in Ahmedabad. The company already has three design centers in India (Hubli, Kolkata and Bangalore). Sankalp Semiconductor has executed multitude of complex digital and mixed signal
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Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311, NYSE: ASX), and Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. The solution consists of the SiP-id™ (System-in-Package – intelligent
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This interview was held with Frederic MAURON, a Senior International Sales with Aptasic SA.
Tell me a bit about your background? How did you first get started with Aptasic?
I have a technical background in micro-electronic and completed a business management graduation in 1993.
Tell me about Aptasic?
CPUs are the heart of all the mobile devices we use today, and their performance is paramount to product design and user experience. More efficient processors can lead to more powerful products while maintaining low power consumption. One of the world’s largest chip manufacturers (and consequently processors), TSMC, which manufactures
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Open-Silicon’s eighth-generation Interlaken IP supports up to 1.2Tbps high-bandwidth performance and up to 56Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for high-bandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch,
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Annual semiconductor unit shipments (integrated circuits and opto-sensor-discretes, or O-S-D, devices) are expected to grow 9% in 2018 and top one trillion units for the first time, based on data presented in the new, 2018 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (Figure 1).
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