Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production
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This interview features Scott Bulbrook, President of DA-Integrated.
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services
Woodcliff Lake, New Jersey — April 29, 2025 — Semiconductor intellectual property core provider CAST today introduced a high-performance Audio Sample Rate Converter (ASRC) IP core that delivers real-time and batch-mode sample rate conversion with exceptional signal integrity, ultra-low distortion, and unmatched scalability. The company believes the new Audio Sample
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UCIe, is a pivotal player in modern chip design that places emphatic power on high-bandwidth data transfer, efficient heat management, and reduced leakage. This standard features bioinspired advancements, system co-optimization, and integration with cutting-edge 3D packaging, which together revolutionize AI, high-performance computing, and consumer electronics. Alongside optical I/O advancements, UCIe
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READING, U.K. – April 28, 2025 – Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team. The company is leveraging decades of experience to deliver advanced System-on-Chip (SoC) solutions and tailored ASIC services that help customers navigate the complex challenges
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Santa Clara, CA / April 23, 2025 – Certus Semiconductor, a leading provider of custom I/O and ESD Solutions to the semiconductor industry, is announcing an official partnership to join the TSMC Intellectual Property (IP) Alliance program, a key element of the TSMC Open Innovation Platform® (OIP).
Certus Semiconductor,
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SAN JOSE, Calif., April 24, 2025 /PRNewswire/ — QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP and user tools, ruggedized FPGAs, and endpoint AI/ML solutions, today announced that its eFPGA IP is now integrated into Faraday Technology Corporation’s cutting-edge FlashKit™-22RRAM SoC Development Platform. The collaboration gives
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SANTA CLARA, Calif.– April 23, 205 –TSMC (TWSE: 2330, NYSE: TSM) today unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power
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April 23, 2025 — KeyASIC, a leading publicly listed ASIC design services company, today announced a partnership with AnySilicon, the premier platform connecting companies with IP cores and ASIC service providers. This collaboration will significantly expand KeyASIC’s marketing reach, providing access to AnySilicon’s extensive network of potential customers actively seeking ASIC
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In the realm of cutting-edge electronics, the shift from silicon-based components to gallium nitride (GaN) technology is making waves across industries. As traditional semiconductors reach their performance limits, GaN High Electron Mobility Transistors (HEMTs) offer a compelling alternative with superior efficiency and enhanced thermal management. Whether you’re an engineer diving
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